KoolMicro, Inc.

KoolMicro (쿨마이크로)

KoolMicro

1. (주)쿨마이크로 / KoolMicro, Inc
Company Overview KoolMicro is a deep-tech startup specializing in high-performance liquid cooling solutions for next-generation semiconductors. Their core innovation, IMMC (Integrated Manifold MicroChannel), addresses the critical thermal bottlenecks of AI and HPC (High-Performance Computing) chips. By integrating cooling channels directly at the chip or package level, they achieve heat dissipation rates significantly higher than conventional methods, making them a key enabler for hyperscale data centers and AI accelerators.

Field
Information
Website
www.koolmicro.com
CES Page
View Exhibitor Details
CEO
Yun Hyeok Im
Category
Nano/Semiconductor, AI Hardware, Data Center Cooling
Headquarters
Daejeon, South Korea (TIPS Town); R&D Centers in Dongtan, Atlanta (USA), and San Jose (USA)
Key Product
IMMC (Integrated Manifold MicroChannel)

Technology & Competitive Advantage

• Core Technology: Proprietary manifold-microchannel structure that allows coolant to flow efficiently over hotspots, reducing thermal resistance by 40% compared to conventional cold plates.
• Performance: Achieved 2,000 W/cm² heat dissipation capability (verified Sep 2022), supporting the extreme thermal density of next-gen GPUs and AI accelerators.
• Efficiency: Delivers 25% faster compute performance and enables a 50% reduction in cooling energy consumption and CO₂ emissions for data centers.
• Form Factor: Ultra-slim profile (sub-5 mm) allowing for seamless integration into high-density server racks without complex plumbing or large tanks. Leak-proof modular joints ensure safety.

Recent Traction & Media Activity (Last 6-12 Months)

• Nov 2025 (SC25): Exhibited at the Supercomputing Conference (SC25), showcasing direct-to-chip cold plates compatible with NVIDIA GB200 dual GPUs, demonstrating significant thermal resistance reduction in live A/B tests against conventional solutions.
• Oct 2025: Established KoolMicro USA, Inc. in San Jose to target the North American data center market.
• Aug 2025: Initiated a Proof of Concept (PoC) with a major global server manufacturer.
• Awards: Winner of the KAIST Alumni Startup League (June 2024); Selected for the TIPS program and secured Seed Round 1 & 2 investments.

1. Potential Partners & Customers at CES 2026
   Based on KoolMicro's focus on high-density thermal management for AI and HPC, the following exhibitors are high-value targets for strategic partnerships, joint development (JDA), or supply chain integration.
   A. Semiconductor & AI Chip Manufacturers
   These companies require advanced cooling to push the clock speeds of their AI accelerators and processors.

2. Intel Corporation

3. Relevance: Major player in data center CPUs and AI accelerators (Gaudi). Active in liquid cooling standards for high-density racks.

4. CES Detail Page: https://exhibitors.ces.tech/8_0/exhibitor/exhibitor-details.cfm?exhid=0013000001LXENOAA5

5. Booth: LVCC, Central Hall — 21240 (Intel usually has a major presence; verified booth from export list).

6. Qualcomm

7. Relevance: Expanding into edge AI and high-performance computing. Their high-wattage chips for automotive and compute require efficient thermal management.

8. CES Detail Page: https://exhibitors.ces.tech/8_0/exhibitor/exhibitor-details.cfm?exhid=00130000008Rq1wAAC

9. Booth: LVCC, West Hall — 5001

10. Arm Ltd

11. Relevance: Designs the architecture for the world’s most power-efficient compute platforms. Partners in the Arm ecosystem often look for cooling solutions that match their efficiency goals.

12. CES Detail Page: https://exhibitors.ces.tech/8_0/exhibitor/exhibitor-details.cfm?exhid=00130000008RrnkAAC
    B. Cloud Computing & Data Center Infrastructure
    These entities build and manage the hyperscale infrastructure where liquid cooling is becoming a necessity.

13. Microsoft

14. Relevance: Microsoft Azure is aggressively adopting liquid cooling for its AI infrastructure. They are a prime target for direct-to-chip cooling PoCs.

15. CES Detail Page: https://exhibitors.ces.tech/8_0/exhibitor/exhibitor-details.cfm?exhid=00130000008Rq2VAAS

16. Alibaba Cloud Computing Ltd.

17. Relevance: A global leader in cloud infrastructure with a strong focus on green data centers and immersion/liquid cooling technologies.

18. CES Detail Page: https://exhibitors.ces.tech/8_0/exhibitor/exhibitor-details.cfm?exhid=001Pp00000pvESMIA2

19. Booth: LVCC, Central Hall — 22020
    C. System Integrators & Engineering Services
    These partners can integrate KoolMicro's cold plates into full server rack solutions.

20. VVDN Technologies Pvt. Ltd.

21. Relevance: A product engineering and manufacturing company working on data center, networking, and cloud solutions. They can be a manufacturing or integration partner.

22. CES Detail Page: https://exhibitors.ces.tech/8_0/exhibitor/exhibitor-details.cfm?exhid=0014V00003Q26kyQAB

23. Booth: LVCC, West Hall — 6067

24. Tata Electronics America, Inc.

25. Relevance: Growing capabilities in electronics manufacturing services (EMS) and semiconductor assembly. Potential partner for mass production of cooling modules.

26. CES Detail Page: https://exhibitors.ces.tech/8_0/exhibitor/exhibitor-details.cfm?exhid=001Pp00001Wiv1iIAB
27. Booth: Santa Clara address listed (Booth usually in West or North Hall).
    D. Strategic Innovation & Investment
28. SK Telecom / SK AI (Often present as SK)
29. Note: While not explicitly in the short export list provided, SK is a major investor in AI chips (Sapeon) and high-bandwidth memory (Hynix), making them a critical local partner for KoolMicro in the Korean ecosystem.
30. CES Detail Page: (Search for SK Group on the live CES portal)